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Forming Tiny 3D Structures For Micro- and Nanofluidics
This article from SPIE describes how dielectric breakdown and wet etching may provide a method of fabricating 3D nano- and microscale channels inside transparent dielectric materials. The article includes several...
The Road to Extreme-Ultraviolet Lithography
Extreme ultraviolet lithography promises to be the key enabler for patterning semiconductor devices of the future, but a number of challenges remain.
Bucky Paper: Stronger Than Steel, Harder Than Diamonds
Working with a material 10 times lighter than steel -- but 250 times stronger -- would be a dream come true for any engineer. If this material also had amazing properties that made it highly conductive of heat and...
Molecular Transistors Based On Quantum Interference
This article from SPIE discusses how harnessing quantum interference enables single aromatic annulene molecules to function as transistors. The article includes several illustrations which help to demonstrate the...
193nm Immersion Lithography: Status and Challenges
This article is a comprehensive review of 193nm immersion lithography. It focuses on the materials and processes rather than the optical system of the tool. The article covers the history and current status of the...
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