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Title: Chemical Mechanical Planarization - Multilayer planarization SWF
Url: http://matec.org/animations/matec/M068FL02.swf
Publisher: Maricopa Advanced Technology Education Center (MATEC)
Description: There are many different ways in which the dual damascene process is used. The animation shows an overview of one process: -In the dual damascene process, a low-k dielectric is added. -CMP is used to remove dielectric down to depth of the vias. -Silicon nitride is deposited and the resist is added and exposed. -The surface is etched and a second layer of low-k dielectric is added. -CMP is used to remove the dielectric down to the final thickness of the metal lines. -Resist is added for vias and metal lines. -The surface is exposed and removed. -The dielectric is etched and the resist is removed. -The metal barrier and metal are added. -Depending on the process, this could be copper. -The metal and metal barrier are removed through CMP. THe objective is to explain the dual damascene process.This simulation is from Module 068 of the Process & Equipment III Cluster of the MATEC Module Library (MML).
LC Classification: Technology -- Electrical engineering. Electronics. Nuclear engineering -- Electrical engineering. Electronics. Nuclear engineering -- Electronics -- Microelectronics. Integrated circuits
Technology -- Mechanical engineering and machinery -- Energy conservation -- Energy conservation or consumption in special industries, facilities, etc., A-Z -- Chemical industry
GEM Subject: Science -- Engineering
Science -- Technology
Key Concept: Manufacturing -- Electrochemical processes
Manufacturing -- Integrated circuits
Key Concepts Complete: Yes
Resource Type: Instructional Materials
InteractiveResource (DCMI Type Vocabulary)
Reading Materials
Science Materials
Format: flash
html
Audience: College/University Instructors
Higher Education
Professional Formation
Secondary Education
Students
Teachers
Technical School First Cycle
University First Cycle
University Postgrad
University Second Cycle
Vocational Training
Language: English
Access Rights: Free access
Date Of Record Release: 2011-02-16 03:00:03 (W3C-DTF)
Date Last Modified: 2011-09-06 10:50:13 (W3C-DTF)
Source Type: ATE Center
Source: NetWorks
Full Record Views: 146
Resource URL Clicks: 21
Cumulative Rating: NOT YET RATED
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